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Common Metals / Materials Used

Common Metals / Materials Used

Hi-Rel has been working with a vast range of microelectronic packaging materials for over 40 years. Certainly, there tend to be more common metals, alloys and ceramics; however, we’ve never turned away an opportunity to support a customer’s more unique, perhaps less common, requirement.

Below is a general listing of materials we commonly work with:

  • Kovar – ASTM F-15 Alloy
  • Alloy 52
  • Invar
  • Molybdenum
  • AlSiC
  • Brass
  • Tin Silver
  • Alloy 42
  • Nickel
  • Aluminum
  • Copper Moly
  • Ceramic (Alumina, AlN)
  • Gold Tin (solder alloy) – different varieties available
  • Silver Copper
  • Alloy 46
  • 300 and 400 series Stainless Steel
  • Titanium
  • Copper-Moly-Copper
  • BeO
  • Gold Germanium – (solder alloy)
  • Tin Bismuth (solder alloy) – multiple varieties
  • Alloy 48
  • Cole Rolled Steel
  • Copper
  • Tungsten-Copper
  • GlidCop
  • Tin Lead (solder alloy) – multiple varieties
  • Solder Alloys, including many lead free