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2017 Tradeshow Participation

February- Hi-Rel is actively involved in supporting the industries we serve and technologies we represent.  Please visit us at the following 2017 tradeshows:

IMAPS – Microtech – in Didcot, United Kingdom (near Oxford) on 16 March – booth TBD

Sensor + Test  – in Nuremberg, Germany from 30 May-1 June – Hall 1 Stand 1-215.  Click here for an on-line admissions ticket to the show.

IMS 2016 Microwave Week – in Honolulu, Hawaii from 6-8 June – booth 536

IMAPS – HiTEN in Cambridge, United Kingdom from 10-12 July-  booth TBD

China International Optoelectronic Exposition  – in Shenzhen, China from 6-9 September – booth TBD

European Microwave Week in Nuremberg, Germany from 10-12 October – booth 249

Contact Us  for further information or if you would like to receive information about how to register for one of these events.

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2016 Hi-Rel Tradeshow Participation

November, 2015 – Hi-Rel is actively involved in supporting the industries we serve and technologies we represent.  Please visit us at the following 2016 tradeshows:

SPIE Photonics West – in San Francisco from 13-18 February in booth 4664

Laser World of Photonics China – in Shanghai from 15-17 March – booth TBD

Sensor + Test in Nuremberg, Germany from 10-12 May – booth TBD

IMAPS – High Temperature Electronics (HiTEC 2016) in Albuquerque, NM from 10-12 May – booth TBD

IMS 2016 Microwave Week – in San Francisco from 22-27 May – booth 2531

European Microwave Week in London from 3-7 October – booth TBD

Contact Us  for further information or if you would like to receive information about how to register for one of these events.

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IMAPS show in Orlando, Florida

October, 2015 – Hi-Rel is pleased to announce its collaboration with Applied DNA Sciences, Inc. in the authentication marking of hermetic package lids. We will be presenting our work together on October 28th at the IMAPS show in Orlando, Florida.

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IMAPS Conference in Cambridge, UK

July, 2015 – We are excited to share the technical paper – “High Temperature Protection Against Unwanted Species within Hermetic Packaging” – which was presented by Richard Rockley of Hi-Rel and Jennifer Williams of Johnson Matthey on July 7th at the IMAPS International Conference & Exhibition on High Temperature Electronics Network in Cambridge, United Kingdom.

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