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Medical Devices

Enabling medical electronics that help protect and save lives

At Hi-Rel, we take our responsibility of supplying medical device microelectronic components to the medical device industry extremely seriously.  We offer dedicated product development and production resources to support this unique industry and its stringent requirements.  And we absolutely understand that failure is not an option.

Our customers need high quality, zero defect support.  They also need a flexible microelectronics supply base that is able to quickly identify solutions addressing various scenarios occurring within the human body.  As a result, Hi-Rel offers critical harsh environment medical device microelectronic components including:  thermal management materials, getter solutions, hermetic lids and solder preforms.  These components allow medical device engineers and designers the flexibility and reliability necessary to meet their specific needs.

Among other things, our capabilities include:

  • Low cost prototyping and innovative solution identification without compromise on quality or performance.
  • Flexibility – our facilities are outfitted to support small order quantities just as easily as large production runs.
  • Quality – one of the most important aspects of all of our processes. In addition to ISO certification at all of our facilities, Hi-Rel has received numerous awards for quality control and excellence.

Above all, Hi-Rel exists to support people and we take great pride in having the opportunity to support our medical device microelectronics customers and ultimately the lives of consumers.

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If you would like information about how we serve the Medical Device Market, please provide us with your contact information and we’ll reach out as soon as possible.

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We support the following high reliability medical device / component applications:

 
Health Monitoring Systems
 
Medical_secondary_implantables
Implantable Devices
 
 

 

Please contact us today – we are absolutely equipped to support your medical device components with microelectronic hybrid packaging components.