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Solder and Braze Preform Solutions

Keep it All Together Each and Every Time…

…with Hi-Rel’s unrivalled solder and braze preform solutions.

With more than 40 years of experience supporting microelectronic applications, the team at Hi-Rel is composed of experts who provide solutions to price, delivery and quality issues that can sometimes challenge electronic device manufacturers.  We work closely with you and your team to thoroughly understand each unique requirement and identify the best solution.

We offer both precious metal and non-precious metal preforms to support a variety of hermetic functional requirements including package construction, component integration, die mounting and hermetic feed-thru attachment.  Hi-Rel differentiates itself by offering:

  • The ability to deliver complex geometries and meet tight tolerance requirements
  • An extensive selection of robust materials and expertise to provide material selection support
  • Extensive tooling available as well as low cost tooling development options
  • The capability to support both low and high volume requirements, as well as to provide quick-turns on delivery requirements
  • A depth of experience across multiple industries that facilities identifying the optimal solution for any given application
  • Complimentary product lines including: lids for hermetic packages, thermal management materials and getter solutions for atmosphere purity within a sealed device

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