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Electronics Running a Little Hot?

Let Hi-Rel take the heat for you with our extensive thermal management solutions.

With advancements in technology, power, speed and expected performance, heat dissipation of sensitive electronic components in hermetically sealed devices is one of the biggest challenges in the microelectronics industry. At Hi-Rel, we are experts in solving complex problems associated with thermal management for power microelectronic applications. We work closely with our customers, metallurgists and engineers to understand each unique challenge and identify the best solution.

We offer both thermal spreaders and thermal base plates that are often used to in hermetic packaging as components to address heat dissipation requirements.  Hi-Rel is unique because it offers:

  • An extensive selection of robust materials including Molybdenum Copper (MoCu), Copper Molybdenum Copper (CMC) and Tungsten Copper (WCu).  We are also at the forefront of investigating and developing new material offerings for future generation heat dissipation requirements
  • The ability to deliver complex geometries and meet tight tolerance requirements
  • A depth of experience across multiple industries that facilities identifying the optimal solution for any given application
  • The capability to support both low and high volume requirements, as well as consistently meeting customer lead-time needs.
  • Complimentary product lines including:  solder and braze preforms, lids for hermetic packages and getter solutions for atmosphere purity within a sealed device
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