In addition to metal lids, getters, thermal management products and solder preforms, Hi-Rel also manufactures additional metal components in support of the microelectronics industry.
Our knowledge of:
- Manufacturing (stamping, machining, sputtering, etching, brazing, plating, soldering)
- Materials (Kovar, Stainless CRS, Molybdenum, OFHC copper, CuMoCu, as well as non metal materials including ceramics and glass windows)
- Managing simple and complex geometries (Components can range in sizes from 0.010″ to 3″ long, 0.010″ to 3″ wide, and 0.005″ to 0.200″ thick)
…make Hi-Rel uniquely qualified to address any special metal component requirement you may have for your microelectronics application.
