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Precision Support Components

Precision Support Components

In addition to metal lids, getters, thermal management products and solder preforms, Hi-Rel also manufactures additional metal components in support of the microelectronics industry.

 Our knowledge of:

  • Manufacturing (stamping, machining, sputtering, etching, brazing, plating, soldering)
  • Materials (Kovar, Stainless CRS, Molybdenum, OFHC copper, CuMoCu, as well as non metal materials including ceramics and glass windows)
  • Managing simple and complex geometries (Components can range in sizes from 0.010″ to 3″ long, 0.010″ to 3″ wide, and 0.005″ to 0.200″ thick)

…make Hi-Rel uniquely qualified to address any special metal component requirement you may have for your microelectronics application.

Our #1 goal is to help our customers address technical challenges and meet their business goals – let us help you. Currently, some of our additional offerings include:

Ring Frames / Seal Rings

Packaging Option for Ceramic / High Thermal Conductivity Materials

Vapor Deposition Materials

Precious Metal Evaporation / Sputter Materials for Thin Film Coating

Lead Frames for Hermetic Packaging

Extensive Offerings to Support a High Density of Leads