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Thermal Management Solutions

Hi-Rel's Thermal Management Solutions Take the Heat for You!

With advancements in technology, power, speed and expected performance, heat dissipation of sensitive electronic components in hermetically sealed devices is one of the biggest challenges in the microelectronics industry. At Hi-Rel, we are experts in solving complex problems associated with thermal management for power microelectronic applications. We work closely with our customers, metallurgists and engineers to understand each unique challenge and identify the best solution based on application, geometry and tolerance requirements.

Proper material selection is fundamental to the thermal management solution and we use technically robust advanced thermal management materials, such as Molybdenum Coper (MoCu), Copper Molybdenum Copper (CMC) and Tungsten Copper (WCu).

The products are machined (EDM or Milled) or stamped to precise size and dimensions and then electroplated. Our products consistently exceed customer expectations for quality, workmanship standards (especially corners and edges), plating requirements and ease of use.

Lead times for Hi-Rel’s thermal management products are typically three to five weeks; however, we also support the need for additional flexibility as required. Our customers are provided with certification of compliance and certification of analysis documentation and Hi-Rel manufactures with adherence to numerous industry standards—ASTM-B-488 (Gold), MIL-G-45204C (Gold), ASTM –B-689 (Electrolytic Nickel), AMS-QQ-N-290 (Electrolytic Nickel), MIL-C-26074E (Electroless Nickel), and ASTM-B-733 (Electroless Nickel) J-Std-006.

Hi-Rel’s Thermal Management Solutions and Information

Material Information

Comparative Material Properties Chart

Base Plates

Thermally Advanced Base Plates for Hermetic Packaging

Thermal Spreaders

Heat Dissipation for Power Packages and High-Performance Chips