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Heat Dissipation Materials

Heat Dissipation Materials

Hi-Rel has well over 100 years of combined experience in metallurgy and the manufacture of metals and metal alloys.

We use technically robust advanced thermal management materials to consistently meet evolving customer requirements and technical heat dissipation challenges.  Below is reference table of common thermal management materials to help you identify the best solution for your application.  Please give us a call – we’re very happy to assist you in the design process.

tertiary_materials
 

Thermal Management Materials Capabilities

Below is a Comparative Material Properties Chart* of common thermal management materials. 

Heatspreader

Categoy

Material

Composition

Coefficient of Thermal Expansion
(ppm / K)

Thermal Conductivity (W/(m*K))

Density

Room Temperature

100oC

Metals

W

100% W

4.5

167

159

19.3

Mo

100% Mo

5.1

159

138

10.2

Cu

100% Cu

16.5

400

8.96

Metals, Composites, Alloys

 

Cu-W

90% W/ 10% Cu

6.5

180

176

17

80% W / 20% Cu

8.3

200

197

15.65

75% W / 25% Cu

9.0

220

230

14.9

Cu – Mo

85% Mo / 15% Cu

7.0

160

156

10.01

70% Mo / 30% Cu

7.1

200

196

9.8

65% Mo / 35% Cu

9.4

210

205

9.7

Metal Laminates

Cu-Mo-Cu

13% Cu / 74% Mo / 13% Cu

5.6

208

9.88

20% Cu / 60% Mo / 20% Cu

6.8

242

9.66

Ceramics

AlN

SALN-20 White

4.5

>200

>180

3.26

Ceramics – Metal

Al-Si

60% Si/ 40% Al

9.1

129

2.46

Al-SiC

70% SiC / 30% Al

8

140

2.6

Si-Sic

18%Si-SiC

3

>200

3

Diamond

CVD-Diamond

2.3

>1000

3.52

Reference Data

Semiconductor

Si

3

151

2.3

GaAs

5.9

46

34

5.32

InP

4.5

70

4.79

GaN

A5.6-c3.2

130

6.15

SiC

3.1

490

3.2

Ceramics

Al2O2

6.7

17

17

3.6

BeO

7.6

251

180

2.9

Metals

Cu

17

393

393

8.93

Al

23

238

2.7

Kovar

5.3

17

17

8.36

Organic

FR-4

X15-y17

0.2

Polyimide

25

0.2

 

*For Reference Only.