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Thermal Management Base Plates

Thermal Management Base Plates

Hi-Rel offers base plates that are made of advanced thermal management materials offering a dual capability for hybrid hermetic packaging.

The table below highlights some of our base plate manufacturing capabilities and offerings.  Please let us know about your specific requirement so that we can customized our offering to meet your needs.

tertiary_base-plate_Gold plated Carrier plate - White (1)

Thermal Management Base Plates and Thermal Spreader Capabilities

Materials Pure Moly
Cu/Mo/Cu (Clad)
Copper /Moly and Copper Tungsten (Composites)
Plating Finishes Gold over Nickel
Shapes / Size Manufactured to precise tolerances of ±0.002″ in length and width, component sizes typically range from 0.010″ to 3″ long, 0.010″ to 3″ wide, and 0.005″ to 0.100″ thick.
Manufacturing Process Machined (EDM or Milled) or stamped
Customer Use Soldering, epoxy
Material Form Flat shapes and complex shapes
Finish Electroplating (Gold over Nickel)
Thermal Conductivity @ 25oC 160 to 220 W/m*K
Coefficient of Thermal Expansion (CTE) @ 25oC 5.7 to 9 ppm / K
Length .010 “ to 3”
Width .010 “ to 3”
Thickness .005” to .100”
Tolerance (Tighter Tolerances Available) .002 in (Major Dimensions) LxW
10% of Thickness (Gauge)
Flatness .001″ in/in flatness (typical)